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Product Description

Optical module products

◆Layer Count：10L
◆Product Model：400Gbps QSFP-DD
◆Material：M6（R-5775）
◆Finished Thickness：1.0±0.075mm
◆Min.Trace/Space：3/3mil
◆Micro vias：L1-L2,L2-L3,L8-L9,L9-L10
◆Buried vias：L3-L8
◆Plug shape tolerance：±0.05mm
◆Copper filled depression：less than 15um
◆Surface Finish：ENEPIG + Gold Finger

CONTACT

Add: 312, Building 4, Hongda Business and Creative Park, No.96 Yuanxiang Road, Yunpu Street, Huangpu District, Guangzhou

Tel: 0086-18318886705

Mob: +8613503037705

Email: pcb@wellfast.online

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PCB
PCBA
IC packaging substrate

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