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Multilayer PCB

5G Communication PCB


◆Layer Count:22L
◆Material:TU-883
◆Board Thickness:3.2mm±0.2mm
◆Min.Trace/Space:3/3mil
◆Copper Type: HVLP
◆Via-in-Pad:VIPPO
◆Back Drill:12 sets
◆Impedance:20 lines


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Tel: 0086-18318886705

Mob: +8613503037705

Email: pcb@wellfast.online

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