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SMT(B/T)+ Pressure Welding +DIP

Product size 250*320*3.0mm
18-Layers PCB
Minimum component specification 0201
Product process characteristics:
High speed connector need to do Pressure Welding; Board is thicker, use selective wave soldering plug-in, ensure that the penetration rate of plug-in tin 100%.

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Email: pcb@wellfast.online

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