We have a range of manufacturing capabilities currently in place, including specific raw materials, PCB technologies, and various types of PCBs, as well as tolerances that we can achieve. Our expertise is demonstrated in two categories of products: standard products that can be easily manufactured through our main or core factories, and products with very specialized processes that can also be produced in a limited number of factories to meet the required specifications.
Key Parameters Of Normal Rigid PCB
Item 项目
标准 Standard
极限 Advanced
板层数
Max Layer Count
36L
48L
Layer Count
板厚
Max PCB Thickness
5.0mm
6.5mm
Board Thickness
Min PCB Thickness
0.2mm
0.1mm
成品尺寸
Max Finished Size
24*35inch
24.5*47inch
Finished Size
成品尺寸公差
Min Routing Tolerance
±0.1mm
±0.05mm
Board Size Tolerance
最大基铜厚度
Inner
12OZ
20OZ
Max Base Copper Weight
Outer
12OZ
20OZ
最小线宽/线距
Outer
75/75um
50/50mil
Min Trace/Spacing
Inner
75/75um
45/45um
机械钻孔孔径
Min Mechanical Drilling
6mil
6mil
Drilling Size
最小机械钻孔PAD
Inner
0.45mm
0.40mm
Min Mechanical Via Pad
Outer
0.40mm
0.35mm
孔径公差
Min Press Fit Hole Tolerance
±2mil
±2mil
Press Fit Hole Tolerance
BGA Pitch
Min BGA Pitch
0.45mm
0.35mm
板厚孔径比
Max PCB Aspect Ratio
10:01
20:01
PCB Aspect Ratio
阻焊桥
Min Solder Mask Dam
3.5mil
3mil
Solder Mask Dam
芯板厚度
Min Core Thickness
0.05mm
0.05mm
Core Thickness
翘曲度
Min Bow & Twist
0.75%
0.50%
Bow & Twist
阻抗公差
Min Impedance Tolerance
±10%
±8%
Impedance Control
表面工艺
Surface Treatment
Electronic Gold Plating、ENIG、Hard Gold Plating、Gold Finger、LF-HAL、OSP、ENEPIG、Soft Gold Plating、Immersion Silver、Immersion Tin、ENIG+OSP、ENIG+G/F、Flash Gold+G/F、Immersion Silver+G/F、Immersion Tin+G/F、HASL
Surface Treatment
材料
Normal TG FR-4
Shengyi, ITEQ, KB, Nanya
Material
Middle TG FR4
Shengyi S1000H, ITEQ IT158, Nanya NY2150
High TG FR4
Shengyi S1000‐2M,S1190,EMC EM827,Isola 370HR,185HR,ITEQ IT180A,TUC TU-768,TU-862 HF,Panasonic R1755V
High Speed Materials
Mid-Loss(1-5G):Isola FR408HR,TU-862 HF,ITEQ IT-170GRA1,EMC EM-355(D),EMC EM-370(5)
Low-Loss(5-10G):EMC EM828, EM888(S), EM888(K),TU-872 SLK,Nelco N4103-13/13 EP/SI/EPSI
Very-Low-Loss(10-25G):Isola I‐Speed, I‐Tera MT,Panasonic R-5775G/M6G,ITEQ IT-968
Ultra-Low-Loss1(25-40G):Panasonic R-5775N/M6N,R-5785/M7
Ultra-Low-Loss2(40-56G):Panasonic R-5785N/M7N, Nelco Meteorwave4000
High Frequency Materials
Rogers RO4350, RO4003C,RO3010,Taconic RF‐30, RF‐35, TLC, TLX, TLY,Taconic 601, 602, 603, 605
Metal Substrate
Shengyi SAR20, Yugu YGA,T110/1/2,T112B/C,VT-4A1/2/3/5,1KA04/6/8
Key Parameters Of HDI
Item 项目
标准 Standard
极限 Advanced
盲孔结构
6+N+6
7+N+7
Structure
叠孔结构
Any Layer(14L)
Any Layer(16L)
HDI Stack Via
最小线宽/间距
Inner
50/50um
40/40um
Min Trace/Spacing
Outer
50/50um
40/50um
纵横比
Max PCB Aspect Ratio
0.8:1
1:01
PCB Aspect Ratio
钻孔尺寸
Min Laser Drilling
4mil
3mil
Drilling Size
线宽/线距
Inner Layer Min Trace/Spacing
0.25mm
0.17mm
Trace/Spacing
Outer Layer Min Trace/Spacing
0.25mm
0.17mm
最小芯板厚度
40um
40um
Min. Core Thickness
最小BGA Pitch
0.4mm
0.3mm
Min BGA Pitch
Key Parameters Of Semiconductor Test Board
Item 项目
标准 Standard
极限 Advanced
板层数
Max Layer Count
30
50
Layer Count
成品尺寸
Max Finished Size
21*26
24*30
Finished Size
板厚
Max PCB Thickness
5.0mm
7.0mm
Board Thickness
板厚公差
Min Thickness Tolerance
±7%
±5%
Board Thickness Tolerance
Min DUT Pitch
0.45mm
0.35mm
压合次数
2
4
Multiple Laminations
平整度
Min Flatness
0.50%
0.20%
Flatness (Symmetrical Construction)
纵横比
Max PCB Aspect Ratio
12:01
25:01:00
PCB Aspect Ratio
阻抗公差
Min Impedance Tolerance
±10%(≥50Ω)
±5%(≥50Ω)
Impedance Control
±5Ω(<50Ω)
±3Ω(<50Ω)
Key Parameters Of Rigid-Flex And Flex PCB
Item 项目
Flex
Rigid-Flex
板层数
Max Layer Count
12L
20L
Layer Count
成品尺寸
Max Finished Size
9inch*98inch
20inch*24inch
Finish Size
成品尺寸公差
Min Routing Tolerance
±0.05mm
±0.1mm
Board Size Tolerance
最小线宽/线距
Outer
3/3mil
3/3mil
Min Trace/Spacing
Inner
2.5/2.5mil
3/3mil
板厚
Max PCB Thickness
0.5mm
6.0mm
Board Thickness
Min PCB Thickness
0.06mm
0.25mm
板厚公差
Min Thickness Tolerance
±0.03mm
±0.1mm
Board Thickness Tolerance
机械钻孔孔径
Min Mechanical Drilling
0.1mm
0.15mm
Drilling Size
孔径公差
Min Press Fit Hole Tolerance
±2mil
±2mil
Press Fit Hole Tolerance
阻抗公差
Min Impedance Tolerance
/
±10%(≥50Ω)
Impedance Control
±5Ω(<50Ω)
最大基铜厚度
Inner
2OZ
6OZ
Max Base Copper Weight
Outer
2OZ
3OZ
翘曲度
Min Bow & Twist
/
0.50%
Bow & Twist
表面工艺
Surface Treatment
LF-HAL、HASL、ENIG、ENEPIG、Electronic Gold Plating、Soft Gold Plating、Hard Gold Plating、Immersion Silver、Immersion Tin、OSP、Gold Finger
Surface Treatment
补强
Stiffener Type
FR4/PI/PET/SUS/PSA
/
Stiffener
柔性材料
Shengyi SF305,Panasonic RF-775,Panasonic RF-777,Dupont AP,Thinflex
Flex Material
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