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We have a range of manufacturing capabilities currently in place, including specific raw materials, PCB technologies, and various types of PCBs, as well as tolerances that we can achieve. Our expertise is demonstrated in two categories of products: standard products that can be easily manufactured through our main or core factories, and products with very specialized processes that can also be produced in a limited number of factories to meet the required specifications.

Key Parameters Of Normal Rigid PCB
Item 项目 标准 Standard 极限 Advanced
板层数 Max Layer Count 36L 48L
Layer Count
板厚 Max PCB Thickness 5.0mm 6.5mm
Board Thickness Min PCB Thickness 0.2mm 0.1mm
成品尺寸 Max Finished Size 24*35inch  24.5*47inch
Finished Size
成品尺寸公差 Min Routing Tolerance ±0.1mm ±0.05mm
Board Size Tolerance
最大基铜厚度 Inner 12OZ 20OZ
Max Base Copper Weight Outer 12OZ 20OZ
最小线宽/线距 Outer 75/75um 50/50mil
Min Trace/Spacing Inner 75/75um 45/45um
机械钻孔孔径 Min Mechanical Drilling 6mil 6mil
Drilling Size
最小机械钻孔PAD Inner 0.45mm 0.40mm
Min Mechanical Via Pad Outer  0.40mm 0.35mm
孔径公差 Min Press Fit Hole Tolerance ±2mil ±2mil
Press Fit Hole Tolerance
BGA Pitch Min BGA Pitch 0.45mm 0.35mm
板厚孔径比 Max PCB Aspect Ratio 10:01 20:01
PCB Aspect Ratio
阻焊桥 Min Solder Mask Dam 3.5mil 3mil
Solder Mask Dam
芯板厚度 Min Core Thickness 0.05mm 0.05mm
Core Thickness
翘曲度 Min Bow & Twist 0.75% 0.50%
Bow & Twist
阻抗公差 Min Impedance Tolerance ±10% ±8%
Impedance Control 
表面工艺 Surface Treatment Electronic Gold Plating、ENIG、Hard Gold Plating、Gold Finger、LF-HAL、OSP、ENEPIG、Soft Gold Plating、Immersion Silver、Immersion Tin、ENIG+OSP、ENIG+G/F、Flash Gold+G/F、Immersion Silver+G/F、Immersion Tin+G/F、HASL
Surface Treatment
材料 Normal TG FR-4 Shengyi, ITEQ, KB, Nanya
Material Middle TG FR4 Shengyi S1000H, ITEQ IT158, Nanya NY2150
 High TG FR4 Shengyi S1000‐2M,S1190,EMC EM827,Isola 370HR,185HR,ITEQ IT180A,TUC TU-768,TU-862 HF,Panasonic R1755V
High Speed Materials  Mid-Loss(1-5G):Isola FR408HR,TU-862 HF,ITEQ IT-170GRA1,EMC EM-355(D),EMC EM-370(5)
 Low-Loss(5-10G)EMC EM828, EM888(S), EM888(K)TU-872 SLKNelco N4103-13/13 EP/SI/EPSI
 Very-Low-Loss(10-25G)Isola ISpeed, ITera MTPanasonic R-5775G/M6GITEQ IT-968
 Ultra-Low-Loss1(25-40G)Panasonic R-5775N/M6NR-5785/M7
 Ultra-Low-Loss2(40-56G)Panasonic R-5785N/M7N Nelco Meteorwave4000
High Frequency Materials Rogers RO4350, RO4003C,RO3010,Taconic RF‐30, RF‐35, TLC, TLX, TLY,Taconic 601, 602, 603, 605
Metal Substrate Shengyi SAR20, Yugu YGA,T110/1/2,T112B/C,VT-4A1/2/3/5,1KA04/6/8
Key Parameters Of HDI
Item 项目 标准 Standard 极限 Advanced
盲孔结构 6+N+6 7+N+7
Structure
叠孔结构 Any Layer(14L) Any Layer(16L)
HDI Stack Via
最小线宽/间距 Inner 50/50um 40/40um
Min Trace/Spacing Outer 50/50um 40/50um
纵横比 Max PCB Aspect Ratio 0.8:1 1:01
PCB Aspect Ratio
钻孔尺寸 Min Laser Drilling 4mil 3mil
Drilling Size
线宽/线距 Inner Layer Min Trace/Spacing 0.25mm 0.17mm
Trace/Spacing Outer Layer Min Trace/Spacing 0.25mm 0.17mm
最小芯板厚度 40um 40um
Min. Core Thickness
最小BGA Pitch 0.4mm 0.3mm
Min BGA Pitch
Key Parameters Of Semiconductor Test Board
Item 项目 标准 Standard 极限 Advanced
板层数 Max Layer Count 30 50
Layer Count
成品尺寸 Max Finished Size 21*26 24*30
Finished Size
板厚 Max PCB Thickness 5.0mm 7.0mm
Board Thickness
板厚公差 Min Thickness Tolerance ±7% ±5%
Board Thickness Tolerance
Min DUT Pitch 0.45mm 0.35mm
压合次数 2 4
Multiple Laminations
平整度 Min Flatness 0.50% 0.20%
Flatness (Symmetrical Construction)
纵横比 Max PCB Aspect Ratio 12:01 25:01:00
PCB Aspect Ratio
阻抗公差 Min Impedance Tolerance ±10%(≥50Ω) ±5%(≥50Ω)
Impedance Control  ±5Ω(<50Ω) ±3Ω(<50Ω)
Key Parameters Of Rigid-Flex And Flex PCB
Item 项目 Flex Rigid-Flex
板层数 Max Layer Count 12L 20L
Layer Count
成品尺寸 Max Finished Size 9inch*98inch 20inch*24inch
Finish Size
成品尺寸公差 Min Routing Tolerance ±0.05mm ±0.1mm
Board Size Tolerance
最小线宽/线距 Outer 3/3mil 3/3mil
Min Trace/Spacing Inner 2.5/2.5mil 3/3mil
板厚 Max PCB Thickness 0.5mm 6.0mm
Board Thickness Min PCB Thickness 0.06mm 0.25mm
板厚公差 Min Thickness Tolerance ±0.03mm ±0.1mm
Board Thickness Tolerance
机械钻孔孔径 Min Mechanical Drilling 0.1mm 0.15mm
Drilling Size
孔径公差 Min Press Fit Hole Tolerance ±2mil ±2mil
Press Fit Hole Tolerance
阻抗公差 Min Impedance Tolerance / ±10%(≥50Ω)
Impedance Control  ±5Ω(<50Ω)
最大基铜厚度 Inner 2OZ 6OZ
Max Base Copper Weight Outer 2OZ 3OZ
翘曲度 Min Bow & Twist / 0.50%
Bow & Twist
表面工艺 Surface Treatment LF-HAL、HASL、ENIG、ENEPIG、Electronic Gold Plating、Soft Gold Plating、Hard Gold Plating、Immersion Silver、Immersion Tin、OSP、Gold Finger
Surface Treatment
补强 Stiffener Type FR4/PI/PET/SUS/PSA /
Stiffener
柔性材料 Shengyi SF305,Panasonic RF-775,Panasonic RF-777,Dupont AP,Thinflex 
Flex Material

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Mob: +8613503037705

Email: pcb@wellfast.online

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